Sputtering systems
Sputtering equipment: Film forming equipment

overview

・ Bonding / separating the substrate to the carrier and depositing it for the process

A transport system that puts in / out the storage.

・ Oxides on large-area substrates for manufacturing Thin Film Transistors

A device that deposits metal materials in a vacuum.

・ Oxide and metal materials on large-area substrates for manufacturing Color Filters

A device that deposits in a vacuum state.

・ Oxide or metal material on medium size substrate

Sputtered Solar or Architecture panel

Used in the electrode layer process of production.

-Board-horizontal transport and vertical conversion,

Carrier-Vertical transport is possible.

・ Simulation cooperation Structured with an optimized design

There is. Also, the amount of deflection is minimized.

A value of Max 0.1 mm.

-Uses Vertical Static Type.

・ Move the Cathode part Magnet to make the thin film

Maximize quality improvement and Target usage efficiency.

-Horizontal dynamic type that can be transported.

・ Move the magnet at the cathode to improve the efficiency of target use.

Achieved maximization and quality improvement of thin films.

-Configuration: Glass Loader / Unloader,

Glass Handling Robot, Carrier Station,

Transfer Station, Magazine, Safety Fence

・ Board compatible size: 8th generation Glass or above

・ Thin-film deposition materials: ITO, SIO, TIO, ZnO, CrOx, AZO,

GZO, IGZO, metal

-Power supply used: DC, Pulsed DC or MF

* Please contact us for detailed structure and specifications.